GENNEL G109 10gram Thermal Conductive Glue, Silicone Glue, Thermal Plaster, Silicone Viscous Adhesive Compound, Heatsink Glue for LED GPU MOSFET Printer Chipset IC High Performance
Non-Electrical Conductive,Non-corrosive ,Non-toxic,Suitable for all heatsink without fixed clip. It has heat conducting properties, strong adhesion. Helps disperse the heat from Chipset to heatsink effectively..
Use for MOSFET, LED, heat sinks , North-south bridge, video card, Chipset, heat dissipation part, heat dissipation, electrical appliances, instruments and other industries..
It has good thermal conductivity and wide service temperature range(-60~250 degrees Celsius).
Thermal conductivity:003e 1.2W/m-K, Do not use thermal glue "between CPU and HEATSINK"!.
Package Includes : 1 x GENNEL G109 10g thermal glue.
8K DisplayPort Switch Splitter,MLEEDA Bidirectional DP 1.4 Switcher 2 in 1 Out / 1 in 2 Out,Supports 8K@30Hz 4K@120Hz,Compatible with Various Interfaces of Video Sources and Displays
Intel LGA 1200 socket: Ready for 11th Gen Intel Core processors.
Enhanced power solution: 8 power stages, alloy chokes and durable capacitors for stable power delivery.
Comprehensive cooling: VRM heatsink, M.2 heatsink, PCH heatsink, hybrid fan headers and Fan Xpert 2+.
ASUS OptiMem: ASUS OptiMem proprietary trace layout allows memory kits to operate at higher frequencies with lower voltages to maximize system performance.
Ultrafast connectivity: PCIe 4.0, Dual M.2, Intel 1 Gb Ethernet, USB 3.2 Gen 2 Type-C and Thunderbolt 4 header support.
Intel Core i5-11600K Desktop Processor 6 Cores up to 4.9 GHz Unlocked LGA1200 & ASUS TUF Gaming Z590-Plus WiFi 6 LGA 1200 (Intel 11th/10th Gen) ATX Gaming Motherboard
Compatible with Intel 500 series & select Intel 400 series chipset based motherboards.
Intel LGA 1200 Socket: Designed to unleash the maximum performance of 11th Gen Intel Core processors.
Enhanced Power Solution: 14+2 DrMOS power stages, ProCool sockets, military-grade TUF components, and Digi+ VRM for maximum durability and performance.
Comprehensive Cooling : VRM heatsink, PCH fanless heatsink, M.2 heatsink, hybrid fan headers and Fan Xpert 4 utility.
MAXSUN iCraft B550 Gaming M-ATX Motherboard AMD AM4 Zen 3, DDR4, PCIe 4.0, SATA 6Gb/s, Dual M.2, USB 3.2 HDMI/DP, 2.5G LAN Micro ATX AMD Ryzen 5000 Series Processors CPU
【AMD AM4 Socket】Supports AMD Zen 3 Ryzen 5000((R9 5950X overclock up to 4.79GHz) & Zen 2 Ryzen 3000 Series CPUs, AMD Zen 2 Ryzen 4000 with Radeon Graphics Cards GPU Processors APUs..
【Super Power Design with 8-Layer PCB】14+2 phases digital power design, providing durable and stable performance. The 8-layer PCB quickly dissipates heat around the VRM to improve overall system stability and give the CPU more overclocking headroom..
【Cooling New Design】Active VRM Heatsink and Large M.2 Heatsink. A VRM heatsink provides a large contact area for the MOSFETs and chokes, enables more efficient cooling for better performance and wattage resistance. The M.2 heatsink keeps the M.2 SSD at the optimum operating temperature for consistent performance and reliability..
【Faster Connectivity】Dual Channel DDR4 Memory(Up to 128 GB 4*DIMMS ,MAX:4866 MHz), Ultra Durable PCIe 4.0 x16 Slot & Ultra-Fast M.2 SSD NVMe PCIe 4.0 x4 Connectors, USB 3.2, HDMI/DP, 2.5G Ethernet and 7.1 Channel HD Audio.
【iCraft Sky Light RGB】Adopt skylight RGB, emits brilliant lights. Provide 2*3-pin ARGB(5V) and 2*4-pin NRGB(12V.). Lighting effects can be controlled via onboard buttons or dedicated software.
ineo Aluminum M.2 2280 SSD Heatsinks with 20mm Fan and Pure Cooper Strip for M.2 NVME SSD [C2600 Fan]
20x20 FAN: 10000 rpm high-perfermance fan, low noise and no vibration, with 8°C - 25°C cooling effect (Varies depending on the environments), very suitable for game players..
Compatible with PCIe NGFF NVMe M.2 SSD Size.
8 x 0.8mm small square): Unique Nano silicone thermal pad. Soft and good ductility, compatible with uneven surfaces.
Low viscosity, no damage to the M.2 SSD warranty label..
Heatsink Design: Groove design, greatly increase the heat dissipation area. Aluminum alloy material, silver plating, anodic oxidation surface treatment. M.2 SSD Heatsink size: 0.94 x 2.95 x 0.24in. (24 x 75 x 6mm), net weight: 0.78oz / 22g. Thermal conductivity of the heatsink: 560W/mK, minimum installation height requirement: 10mm, ONLY FIT FOR DESKTOP.