GENNEL G109 10gram Thermal Conductive Glue, Silicone Glue, Thermal Plaster, Silicone Viscous Adhesive Compound, Heatsink Glue for LED GPU MOSFET Printer Chipset IC High Performance
Non-Electrical Conductive,Non-corrosive ,Non-toxic,Suitable for all heatsink without fixed clip. It has heat conducting properties, strong adhesion. Helps disperse the heat from Chipset to heatsink effectively..
Use for MOSFET, LED, heat sinks , North-south bridge, video card, Chipset, heat dissipation part, heat dissipation, electrical appliances, instruments and other industries..
It has good thermal conductivity and wide service temperature range(-60~250 degrees Celsius).
Thermal conductivity:003e 1.2W/m-K, Do not use thermal glue "between CPU and HEATSINK"!.
Package Includes : 1 x GENNEL G109 10g thermal glue.
Intel Core i5-11600K Desktop Processor 6 Cores up to 4.9 GHz Unlocked LGA1200 & ASUS TUF Gaming Z590-Plus WiFi 6 LGA 1200 (Intel 11th/10th Gen) ATX Gaming Motherboard
Compatible with Intel 500 series & select Intel 400 series chipset based motherboards.
Intel LGA 1200 Socket: Designed to unleash the maximum performance of 11th Gen Intel Core processors.
Enhanced Power Solution: 14+2 DrMOS power stages, ProCool sockets, military-grade TUF components, and Digi+ VRM for maximum durability and performance.
Comprehensive Cooling : VRM heatsink, PCH fanless heatsink, M.2 heatsink, hybrid fan headers and Fan Xpert 4 utility.
ASUS ROG Strix Z690-A Gaming WiFi D4 LGA1700(Intel® 12th Gen) ATX Gaming Motherboard(PCIe 5.0,DDR4,16+1 Power Stages,WiFi 6,2.5 Gb LAN,BT v5.2,Thunderbolt 4,4xM.2 and Front USB 3.2 Gen 2x2 Type-C)
AI Motherboard : AI Overclocking, AI cooling, AI networking(GameFirst VI) and AI noise cancellation.
Robust Power Solution: 16+1 power stages with ProCool II power connector, high-quality alloy chokes and durable capacitors to support multi-core processors.
Optimized Thermal Design: VRM heatsink, PCH fanless heatsink, double-sided M.2 heatsink, hybrid fan headers and Fan Xpert 4 utility.
High-performance Gaming Networking: On-board WiFi 6 and Intel 2.5 Gb Ethernet with ASUS LANGuard.
Best Gaming Connectivity: Supports HDMI 2.0 and DisplayPort 1.4 output, and featuring quad M.2 and USB 3.2 Gen 2x2 Type-C & Type-A and Front panel USB 3.2 Gen 2x2 Type-C connectors .
PC DIY Friendly: SafeDIMM, PCIe 5.0 Safeslot, Q-LED, M.2 Q-Latch, CPU socket lever protector, Pre-mount I/O shield, BIOS FlashBack, Clr CMOS button, Q-Code and FlexKey (Reset, Aura on/off, Direct key).
Industry-leading Gaming Audio: High fidelity audio with ALC4080 with Savitech SV3H712 amplifier, along with DTS Sound Unbound and Sonic Studio III .
New ROG Strix Aesthetics: New ID design, Illuminated Acrylic Display, ASUS-exclusive Aura Sync RGB lighting, including RGB headers and Gen 2 addressable headers.
Micro Center AMD Ryzen 7 5800X 8-Core 16-Thread AM4 Unlocked Desktop Processor with ASUS TUF Gaming X570-PLUS (WI-FI) PCIe 4.0 Dual M.2 USB 3.2 Gen 2 ATX Gaming Motherboard Bundle
AMD Ryzen 7 5800X with 8 Cores and 16 procesing threads cpu processor,Cooler not included,Can deliver elite 100-plus FPS performance,OS Support-Windows 10 64-Bit Edition.
4.7 GHz Max Boost, unlocked for overclocking, 36 MB of cache, DDR-3200 support,For the advanced Socket AM4 platform, can support PCIe 4.0 on X570 and B550 motherboards.
AMD AM4 X570 ATX gaming motherboard with PCIe 4.0, dual M.2, Wi-Fi, 14 Dr. MOS power stages, HDMI, DP, SATA 6Gb/s, USB 3.2 Gen 2 Type-A /Type-C and Realtek S1200A Codec,Aura Sync RGB lighting.
Ready for AMD Ryzen 5000 Series/ 4000 G-Series/ 3000 Series/ 3000 G-Series/ 2000 Series/ 2000 G-Series desktop processors,Gaming Networking: Exclusive Realtek L8200A Gigabit Ethernet, Intel 2x2 802.11ac Wi-Fi with MU-MIMO support, Bluetooth 5.0, TUF LANGuard and TurboLAN technology.
Enhanced Power Solution: 12+2 Dr. MOS power stages, 6-layer PCB, ProCool sockets, military-grade TUF components, and Digi+ VRM for maximum durability,Comprehensive Cooling: Active chipset heatsink, VRM heatsink, M.2 heatsink, hybrid fan headers and Fan Xpert 4.
[Main Body Material: Copper]. Thermal conductivity: 401W/mK.
Dimension: 76mmx22mmx1mm/ 3.03' x 0.86' x 0.04' (L*W*T).
[Greatly increase the heat dissipation area], Special design for cooling your Laptop RAM to a safe temp to avoid overheating and throttling, improve your computer's performance..
[Unique High Performance Thermal Tape]: Nano thermal tape for efficient heat conductivity..
Each pack includes: 1 piece Laptop m.2 2280 copper heatsink + Nano thermal pad in two thicknesses 70x22x1mm and 70x22x0.5mm..
ASUS Prime B660-PLUS D4 LGA 1700(Intel 12th Gen) ATX Motherboard(PCIe 4.0, DDR4,3xM.2 Slots, 2.5Gb LAN, Rear USB 3.2 Gen 2x2 Type-C, Front USB 3.2 Gen 1 Type-C, Thunderbolt 4 Header Support)
Intel LGA 1700 socket: Ready for 12th Gen Intel Core, Pentium Gold and Celeron Processors.
Comprehensive cooling: VRM heatsink, M.2 heatsink, PCH heatsink, hybrid fan headers and Fan Xpert 2+.
ASUS OptiMem: Careful routing of traces and vias to preserve signal integrity for improved memory stability.