MAXSUN iCraft B550 Gaming M-ATX Motherboard AMD AM4 Zen 3, DDR4, PCIe 4.0, SATA 6Gb/s, Dual M.2, USB 3.2 HDMI/DP, 2.5G LAN Micro ATX AMD Ryzen 5000 Series Processors CPU
【AMD AM4 Socket】Supports AMD Zen 3 Ryzen 5000((R9 5950X overclock up to 4.79GHz) & Zen 2 Ryzen 3000 Series CPUs, AMD Zen 2 Ryzen 4000 with Radeon Graphics Cards GPU Processors APUs..
【Super Power Design with 8-Layer PCB】14+2 phases digital power design, providing durable and stable performance. The 8-layer PCB quickly dissipates heat around the VRM to improve overall system stability and give the CPU more overclocking headroom..
【Cooling New Design】Active VRM Heatsink and Large M.2 Heatsink. A VRM heatsink provides a large contact area for the MOSFETs and chokes, enables more efficient cooling for better performance and wattage resistance. The M.2 heatsink keeps the M.2 SSD at the optimum operating temperature for consistent performance and reliability..
【Faster Connectivity】Dual Channel DDR4 Memory(Up to 128 GB 4*DIMMS ,MAX:4866 MHz), Ultra Durable PCIe 4.0 x16 Slot & Ultra-Fast M.2 SSD NVMe PCIe 4.0 x4 Connectors, USB 3.2, HDMI/DP, 2.5G Ethernet and 7.1 Channel HD Audio.
【iCraft Sky Light RGB】Adopt skylight RGB, emits brilliant lights. Provide 2*3-pin ARGB(5V) and 2*4-pin NRGB(12V.). Lighting effects can be controlled via onboard buttons or dedicated software.
ineo Aluminum M.2 2280 SSD Heatsinks with 20mm Fan and Pure Cooper Strip for M.2 NVME SSD [C2600 Fan]
20x20 FAN: 10000 rpm high-perfermance fan, low noise and no vibration, with 8°C - 25°C cooling effect (Varies depending on the environments), very suitable for game players..
Compatible with PCIe NGFF NVMe M.2 SSD Size.
8 x 0.8mm small square): Unique Nano silicone thermal pad. Soft and good ductility, compatible with uneven surfaces.
Low viscosity, no damage to the M.2 SSD warranty label..
Heatsink Design: Groove design, greatly increase the heat dissipation area. Aluminum alloy material, silver plating, anodic oxidation surface treatment. M.2 SSD Heatsink size: 0.94 x 2.95 x 0.24in. (24 x 75 x 6mm), net weight: 0.78oz / 22g. Thermal conductivity of the heatsink: 560W/mK, minimum installation height requirement: 10mm, ONLY FIT FOR DESKTOP.
ASUS Prime B660-PLUS D4 LGA 1700(Intel 12th Gen) ATX Motherboard(PCIe 4.0, DDR4,3xM.2 Slots, 2.5Gb LAN, Rear USB 3.2 Gen 2x2 Type-C, Front USB 3.2 Gen 1 Type-C, Thunderbolt 4 Header Support)
Intel LGA 1700 socket: Ready for 12th Gen Intel Core, Pentium Gold and Celeron Processors.
Comprehensive cooling: VRM heatsink, M.2 heatsink, PCH heatsink, hybrid fan headers and Fan Xpert 2+.
ASUS OptiMem: Careful routing of traces and vias to preserve signal integrity for improved memory stability.